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CMF01
TOSHIBA Fast Recovery Diode Silicon Diffused Type
CMF01
Switching Mode Power Supply Applications DC/DC Converter Applications
* * * * * Repetitive peak reverse voltage: VRRM = 600 V Average forward current: IF (AV) = 2.0 A Forward voltage: VFM = 2.0 V (max) Very fast reverse-recovery time: trr = 100 ns (max.) Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name) Unit: mm
Absolute Maximum Ratings (Ta = 25C)
Characteristic Repetitive peak reverse voltage Average forward current Peak one-cycle surge forward current (non-repetitive) Junction temperature Storage temperature range Symbol VRRM IF (AV) IFSM Tj Tstg Rating 600 2.0 (Note 1) 30 (50 Hz) -40~150 -40~150 Unit V A A C C
JEDEC JEITA TOSHIBA
3-4E1A
Note 1: T =100C Device mounted on a ceramic board Board size: 50 mm x 50 mm, Soldering land size: 2 mm x 2 mm Board thickness: 0.64 t Rectangular waveform ( = 180)
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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CMF01
Electrical Characteristics (Ta = 25C)
Characteristic Peak forward voltage Repetitive peak reverse current Reverse recovery time Forward recovery time Symbol VFM IRRM trr tfr Test Condition IFM = 2.0 A (pulse test) VRRM = 600 V (pulse test) IF = 1 A, di/dt -30 A/s IF = 1 A Device mounted on a ceramic board (board size: 50 mm x 50 mm) (soldering land: 2 mm x 2 mm) (board thickness: 0.64 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 2.1 mm x 1.4 mm) (board thickness: 1.6 t) Thermal resistance (junction to lead) Rth (j-) Min Typ. 1.4 270 Max 2.0 50 100 Unit V A ns ns
60
Thermal resistance
Rth (j-a)
135
C/W
210
16
C/W
Marking
Abbreviation Code Part No.
Standard Soldering Pad
Unit: mm
F1
CMF01
2.1 1.4 3.0 1.4
Handling Precautions
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods we recommend for designing a circuit using this device. VRRM: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit; and no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient (0.1%/). Be sure to take this temperature coefficient into account when designing a device for use at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV). Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by using an allowable Tamax-IF (AV) curve. This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180. Therefore the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device. For this device, we recommend a Tj of below 120 under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance value. Refer to the Rectifier databook for further information.
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CMF01
iF - vF
100 2.8 Pulse test
PF (AV) - IF (AV)
iF (A)
10 150C 75C Tj = 25C
Average forward power dissipation PF (AV) (W)
2.4 2.0 1.6 1.2 0.8 0.4 0 0 0 360 Conduction angle = 60 120 Rectangular waveform
Instantaneous forward current
180
1
0.1
0.01
0
1.0
2.0
3.0
4.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
Instantaneous forward voltage VF
(V)
Average forward current
IF (AV)
(A)
Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm, land size: 6 mm x 6 mm) 160 160
Ta max - IF (AV)
Device mounted on a ceramic board (board size: 50 mm x 50 mm, land size: 2 mm x 2 mm)
T max - IF (AV)
Maximum allowable ambient temperature Ta max (C)
140 120 100 80 60 120 40 20 0 0 = 60 0 360 180 Conduction angle: 1.6 2.0 2.4 2.8 Rectangular waveform
Maximum allowable lead temperature T max (C)
140 120 100 80 60 40 0 360 20 0 0 Conduction angle: 0.4 0.8 1.2 1.6 2.0 2.4 2.8 = 60 Rectangular waveform 120 180
0.4
0.8
1.2
Average forward current
IF (AV)
(A)
Average forward current
IF (AV)
(A)
Surge forward current
(non-repetitive)
40 1000 Ta = 25C f = 50 Hz 30
rth (j-a) - t
Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm, land size: 2.1 mm x 1.4 mm, board thickness: 1.6 t)
IFSM (A)
Peak surge forward current
Transient thermal impedance rth (j-a) (C/W)
100
20
10
10
Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm, land size: 6 mm x 6 mm, board thickness: 1.6 t) Device mounted on a ceramic board (board size: 50 mm x 50 mm, land size: 2 mm x 2 mm, board thickness: 0.64 t)
0 1
10
100
1 0.001
0.01
0.1
1
10
100
1000
Number of cycles
Time t (s)
3
2006-11-07
CMF01
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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2006-11-07

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